Chen, Z.; Hu, J.; Zhou, H.; Wei, Y.; Zhang, G.; Han, F.
Investigation of the Thermophysical Simulation and Material Removal Mechanism of the High-Volume-Fraction SiCp/Al Composite in Wire Electrical Discharge Machining. Materials 2024, 17, 5546.
https://doi.org/10.3390/ma17225546
AMA Style
Chen Z, Hu J, Zhou H, Wei Y, Zhang G, Han F.
Investigation of the Thermophysical Simulation and Material Removal Mechanism of the High-Volume-Fraction SiCp/Al Composite in Wire Electrical Discharge Machining. Materials. 2024; 17(22):5546.
https://doi.org/10.3390/ma17225546
Chicago/Turabian Style
Chen, Zhi, Jiawen Hu, Hongbing Zhou, Yumeng Wei, Guojun Zhang, and Fenglin Han.
2024. "Investigation of the Thermophysical Simulation and Material Removal Mechanism of the High-Volume-Fraction SiCp/Al Composite in Wire Electrical Discharge Machining" Materials 17, no. 22: 5546.
https://doi.org/10.3390/ma17225546
APA Style
Chen, Z., Hu, J., Zhou, H., Wei, Y., Zhang, G., & Han, F.
(2024). Investigation of the Thermophysical Simulation and Material Removal Mechanism of the High-Volume-Fraction SiCp/Al Composite in Wire Electrical Discharge Machining. Materials, 17(22), 5546.
https://doi.org/10.3390/ma17225546