Li, W.; Li, Z.; Zeng, F.-Y.; Zhang, Q.; Guo, L.; Li, D.; Ma, Y.-H.; Liu, Z.-Q.
Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding. Materials 2024, 17, 5405.
https://doi.org/10.3390/ma17225405
AMA Style
Li W, Li Z, Zeng F-Y, Zhang Q, Guo L, Li D, Ma Y-H, Liu Z-Q.
Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding. Materials. 2024; 17(22):5405.
https://doi.org/10.3390/ma17225405
Chicago/Turabian Style
Li, Wenjie, Zhe Li, Fang-Yuan Zeng, Qi Zhang, Liwei Guo, Dan Li, Yong-Hui Ma, and Zhi-Quan Liu.
2024. "Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding" Materials 17, no. 22: 5405.
https://doi.org/10.3390/ma17225405
APA Style
Li, W., Li, Z., Zeng, F.-Y., Zhang, Q., Guo, L., Li, D., Ma, Y.-H., & Liu, Z.-Q.
(2024). Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding. Materials, 17(22), 5405.
https://doi.org/10.3390/ma17225405
