Article Versions Notes

Lu F, Sun H, Yang W, Zhou T, Wang Y, Ma H, Ma H, Chen J. Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination. Materials. 2024; 17(21):5172. https://doi.org/10.3390/ma17215172

Lu, Fuye, Han Sun, Wenlong Yang, Tianshuo Zhou, Yunpeng Wang, Haoran Ma, Haitao Ma, and Jun Chen. 2024. "Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination" Materials 17, no. 21: 5172. https://doi.org/10.3390/ma17215172

Lu, F., Sun, H., Yang, W., Zhou, T., Wang, Y., Ma, H., Ma, H., & Chen, J. (2024). Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination. Materials, 17(21), 5172. https://doi.org/10.3390/ma17215172