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Journal: Materials, 2024
Volume: 17
Number: 3849
Article:
Simulation-Guided Analysis towards Trench Depth Optimization for Enhanced Flexibility in Stretch-Free, Shape-Induced Interconnects for Flexible Electronics
Authors:
by
Daniel Joch, Thomas Lang, Shawn Sanctis and Michael P. M. Jank
Link:
https://www.mdpi.com/1996-1944/17/15/3849
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