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Journal: Materials, 2024
Volume: 17
Number: 3602
Article:
Reliability Risk Mitigation in Advanced Packages by Aging-Induced Precipitation of Bi in Water-Quenched Sn–Ag–Cu–Bi Solder
Authors:
by
Vishnu Shukla, Omar Ahmed, Peng Su and Tengfei Jiang
Link:
https://www.mdpi.com/1996-1944/17/14/3602
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