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Journal: Materials, 2024
Volume: 17
Number: 3338

Article: Numerical Simulation of Electromagnetic–Thermal–Fluid Coupling for the Deformation Behavior of Titanium–Aluminum Alloy under Electromagnetic Levitation
Authors: by Xiaoliang Wang, Guifang Zhang, Peng Yan, Xinchen Pang and Zhixiang Xiao
Link: https://www.mdpi.com/1996-1944/17/13/3338

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