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Journal: Materials, 2023
Volume: 16
Number: 2991

Article: Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder
Authors: by Roman Kolenak, Tomas Melus, Jaromir Drapala, Peter Gogola and Matej Pasak
Link: https://www.mdpi.com/1996-1944/16/8/2991

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