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Journal: Materials, 2023
Volume: 16
Number: 7450
7450
Article: Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface
Authors: by Joohyun Lee, Wonhyuk Jo, Ji-Hwan Kwon, Bruce Griffin, Byeong-Gwan Cho, Eric C. Landahl and Sooheyong Lee
Link: https://www.mdpi.com/1996-1944/16/23/7450

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