Baek, N.; Park, Y.; Lim, H.; Cha, J.; Jang, T.; Kang, S.; Jang, S.; Jung, D.
Change in Electrical/Mechanical Properties of Plasma Polymerized Low Dielectric Constant Films after Etching in CF4/O2 Plasma for Semiconductor Multilevel Interconnects. Materials 2023, 16, 4663.
https://doi.org/10.3390/ma16134663
AMA Style
Baek N, Park Y, Lim H, Cha J, Jang T, Kang S, Jang S, Jung D.
Change in Electrical/Mechanical Properties of Plasma Polymerized Low Dielectric Constant Films after Etching in CF4/O2 Plasma for Semiconductor Multilevel Interconnects. Materials. 2023; 16(13):4663.
https://doi.org/10.3390/ma16134663
Chicago/Turabian Style
Baek, Namwuk, Yoonsoo Park, Hyuna Lim, Jihwan Cha, Taesoon Jang, Shinwon Kang, Seonhee Jang, and Donggeun Jung.
2023. "Change in Electrical/Mechanical Properties of Plasma Polymerized Low Dielectric Constant Films after Etching in CF4/O2 Plasma for Semiconductor Multilevel Interconnects" Materials 16, no. 13: 4663.
https://doi.org/10.3390/ma16134663
APA Style
Baek, N., Park, Y., Lim, H., Cha, J., Jang, T., Kang, S., Jang, S., & Jung, D.
(2023). Change in Electrical/Mechanical Properties of Plasma Polymerized Low Dielectric Constant Films after Etching in CF4/O2 Plasma for Semiconductor Multilevel Interconnects. Materials, 16(13), 4663.
https://doi.org/10.3390/ma16134663
