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Journal: Materials, 2023
Volume: 16
Number: 3885
Article:
Microstructural Changes Caused by the Creep Test in ZK60 Alloy Reinforced by SiCp at Intermediate Temperature after KOBO Extrusion and Aging
Authors:
by
Yang-Yang Wang, Chen Jia, Min Xu, Mosab Kaseem and Morteza Tayebi
Link:
https://www.mdpi.com/1996-1944/16/10/3885
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