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Journal: Materials, 2023
Volume: 16
Number: 3885

Article: Microstructural Changes Caused by the Creep Test in ZK60 Alloy Reinforced by SiCp at Intermediate Temperature after KOBO Extrusion and Aging
Authors: by Yang-Yang Wang, Chen Jia, Min Xu, Mosab Kaseem and Morteza Tayebi
Link: https://www.mdpi.com/1996-1944/16/10/3885

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