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Journal: Materials, 2023
Volume: 16
Number: 96
96
Article: Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy
Authors: by Siti Faqihah Roduan, Juyana A. Wahab, Mohd Arif Anuar Mohd Salleh, Nurul Aida Husna Mohd Mahayuddin, Mohd Mustafa Al Bakri Abdullah, Aiman Bin Mohd Halil, Amira Qistina Syamimi Zaifuddin, Mahadzir Ishak Muhammad, Andrei Victor Sandu, Mădălina Simona Baltatu and Petrica Vizureanu
Link: https://www.mdpi.com/1996-1944/16/1/96

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