Order Article Reprints
Journal: Materials, 2023
Volume: 16
Number: 449
Article:
Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading
Authors:
by
Min Zhang, Fangzhou Chen, Fei Qin, Si Chen and Yanwei Dai
Link:
https://www.mdpi.com/1996-1944/16/1/449
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.