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Journal: Materials, 2023
Volume: 16
Number: 449

Article: Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading
Authors: by Min Zhang, Fangzhou Chen, Fei Qin, Si Chen and Yanwei Dai
Link: https://www.mdpi.com/1996-1944/16/1/449

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