Meng, Y.; Gao, R.; Wang, X.; Huang, S.; Wei, K.; Wang, D.; Mu, F.; Liu, X.
Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting. Materials 2022, 15, 2529.
https://doi.org/10.3390/ma15072529
AMA Style
Meng Y, Gao R, Wang X, Huang S, Wei K, Wang D, Mu F, Liu X.
Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting. Materials. 2022; 15(7):2529.
https://doi.org/10.3390/ma15072529
Chicago/Turabian Style
Meng, Ying, Runhua Gao, Xinhua Wang, Sen Huang, Ke Wei, Dahai Wang, Fengwen Mu, and Xinyu Liu.
2022. "Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting" Materials 15, no. 7: 2529.
https://doi.org/10.3390/ma15072529
APA Style
Meng, Y., Gao, R., Wang, X., Huang, S., Wei, K., Wang, D., Mu, F., & Liu, X.
(2022). Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting. Materials, 15(7), 2529.
https://doi.org/10.3390/ma15072529