Article Versions Notes

Ke X, Wu W, Li K, Yu Y, Wang T, Zhong B, Wang Z, Guo J, Wang C. Effect of the Binder during Ultra-Precision Polishing of Tungsten Carbide Using a Semirigid Bonnet Tool. Materials. 2022; 15(23):8327. https://doi.org/10.3390/ma15238327

Ke, Xiaolong, Wei Wu, Kangsen Li, Yongheng Yu, Tianyi Wang, Bo Zhong, Zhenzhong Wang, Jiang Guo, and Chunjin Wang. 2022. "Effect of the Binder during Ultra-Precision Polishing of Tungsten Carbide Using a Semirigid Bonnet Tool" Materials 15, no. 23: 8327. https://doi.org/10.3390/ma15238327

Ke, X., Wu, W., Li, K., Yu, Y., Wang, T., Zhong, B., Wang, Z., Guo, J., & Wang, C. (2022). Effect of the Binder during Ultra-Precision Polishing of Tungsten Carbide Using a Semirigid Bonnet Tool. Materials, 15(23), 8327. https://doi.org/10.3390/ma15238327