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Journal: Materials, 2022
Volume: 15
Number: 7588
Article:
Thermal Conductance of Copper–Graphene Interface: A Molecular Simulation
Authors:
by
Jiarui Zhu, Shuhui Huang, Zhongnan Xie, Hong Guo and Hui Yang
Link:
https://www.mdpi.com/1996-1944/15/21/7588
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