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Journal: Materials, 2022
Volume: 15
Number: 7115

Article: Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints
Authors: by Po-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran, Kai-Cheng Shie, Nien-Ti Tsou and Chih Chen
Link: https://www.mdpi.com/1996-1944/15/20/7115

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