Hsu, P.-N.; Lee, D.-L.; Tran, D.-P.; Shie, K.-C.; Tsou, N.-T.; Chen, C.
Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints. Materials 2022, 15, 7115.
https://doi.org/10.3390/ma15207115
AMA Style
Hsu P-N, Lee D-L, Tran D-P, Shie K-C, Tsou N-T, Chen C.
Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints. Materials. 2022; 15(20):7115.
https://doi.org/10.3390/ma15207115
Chicago/Turabian Style
Hsu, Po-Ning, Dai-Lung Lee, Dinh-Phuc Tran, Kai-Cheng Shie, Nien-Ti Tsou, and Chih Chen.
2022. "Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints" Materials 15, no. 20: 7115.
https://doi.org/10.3390/ma15207115
APA Style
Hsu, P.-N., Lee, D.-L., Tran, D.-P., Shie, K.-C., Tsou, N.-T., & Chen, C.
(2022). Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints. Materials, 15(20), 7115.
https://doi.org/10.3390/ma15207115