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Journal: Materials, 2021
Volume: 14
Number: 2367
2367
Article: Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate
Authors: by Junhyuk Son, Dong-Yurl Yu, Yun-Chan Kim, Shin-Il Kim, Min-Su Kim, Dongjin Byun and Junghwan Bang
Link: https://www.mdpi.com/1996-1944/14/9/2367

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