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Journal: Materials, 2021
Volume: 14
Number: 2218
Article:
Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components
Authors:
by
Nabi S. Shabanov, Kamil Sh. Rabadanov, Sagim I. Suleymanov, Akhmed M. Amirov, Abdulgalim B. Isaev, Dinara S. Sobola, Eldar K. Murliev and Gulnara A. Asvarova
Link:
https://www.mdpi.com/1996-1944/14/9/2218
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