Article Versions Notes

Silva ÂDM, Silva MM, Figueiredo H, Delgado I, Lopes PE, Paiva MC, Hilliou L. Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB. Materials. 2021; 14(24):7734. https://doi.org/10.3390/ma14247734

Silva, Ângelo D. M., Mariana M. Silva, Hugo Figueiredo, Isabel Delgado, Paulo E. Lopes, Maria C. Paiva, and Loic Hilliou. 2021. "Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB" Materials 14, no. 24: 7734. https://doi.org/10.3390/ma14247734

Silva, Â. D. M., Silva, M. M., Figueiredo, H., Delgado, I., Lopes, P. E., Paiva, M. C., & Hilliou, L. (2021). Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB. Materials, 14(24), 7734. https://doi.org/10.3390/ma14247734