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Journal: Materials, 2021
Volume: 14
Number: 6222

Article: Modeling and Analysis of a SiC Microstructure-Based Capacitive Micro-Accelerometer
Authors: by Xiang Tian, Wei Sheng, Zhanshe Guo, Weiwei Xing and Runze Tang
Link: https://www.mdpi.com/1996-1944/14/20/6222

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