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Journal: Materials, 2021
Volume: 14
Number: 5522
Article:
Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling
Authors:
by
Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, Dinh-Phuc Tran and Chih Chen
Link:
https://www.mdpi.com/1996-1944/14/19/5522
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