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Journal: Materials, 2021
Volume: 14
Number: 2571

Article: Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer
Authors: by Xiaoli Wang, Chau-Chang Chou, Liberty Tse-Shu Wu, Rudder Wu, Jyh-Wei Lee and Horng-Yi Chang
Link: https://www.mdpi.com/1996-1944/14/10/2571

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