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Journal: Materials, 2021
Volume: 14
Number: 2486

Article: Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration
Authors: by Wu Yue, Chao Ding, Hongbo Qin, Chenggong Gong and Junxi Zhang
Link: https://www.mdpi.com/1996-1944/14/10/2486

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