Yue, W.; Ding, C.; Qin, H.; Gong, C.; Zhang, J.
Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration. Materials 2021, 14, 2486.
https://doi.org/10.3390/ma14102486
AMA Style
Yue W, Ding C, Qin H, Gong C, Zhang J.
Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration. Materials. 2021; 14(10):2486.
https://doi.org/10.3390/ma14102486
Chicago/Turabian Style
Yue, Wu, Chao Ding, Hongbo Qin, Chenggong Gong, and Junxi Zhang.
2021. "Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration" Materials 14, no. 10: 2486.
https://doi.org/10.3390/ma14102486
APA Style
Yue, W., Ding, C., Qin, H., Gong, C., & Zhang, J.
(2021). Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration. Materials, 14(10), 2486.
https://doi.org/10.3390/ma14102486