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Journal: MaterialsVolume: 13Number: 4257
Article: Thermal Contact Conductance-Based Thermal Behavior Analytical Model for a Hybrid Floor at Elevated Temperatures
  • Authors:
  • Min Jae Park1,
  • Jeong Ki Min2 and
  • Jaehoon Bae1
  • et al.
Link: https://www.mdpi.com/1996-1944/13/19/4257

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