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Journal: Materials, 2020
Volume: 13
Number: 4257
Article:
Thermal Contact Conductance-Based Thermal Behavior Analytical Model for a Hybrid Floor at Elevated Temperatures
Authors:
by
Min Jae Park, Jeong Ki Min, Jaehoon Bae and Young K. Ju
Link:
https://www.mdpi.com/1996-1944/13/19/4257
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