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Journal: Materials, 2020
Volume: 13
Number: 3926
Article:
Stress and Microstructure Evolution in Mo Thin Films without or with Cover Layers during Thermal-Cycling
Authors:
by
Eunmi Park, Marietta Seifert, Gayatri K. Rane, Siegfried B. Menzel, Thomas Gemming and Kornelius Nielsch
Link:
https://www.mdpi.com/1996-1944/13/18/3926
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