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Journal: Materials, 2020
Volume: 13
Number: 3278

Article: Non-Linear Conductivity Epoxy/SiC Composites for Emerging Power Module Packaging: Fabrication, Characterization and Application
Authors: by Rui Li, Yufan Wang, Cheng Zhang, Hucheng Liang, Jin Li and Boxue Du
Link: https://www.mdpi.com/1996-1944/13/15/3278

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