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Open AccessArticle

Effect of Residual Stress on Thermal Deformation Behavior

1
Graduate School of Science and Technology, Niigata University, Niigata 9502181, Japan
2
Department of Chemistry and Physics, Southeastern Louisiana University, Hammond, LA 70402, USA
*
Author to whom correspondence should be addressed.
Materials 2019, 12(24), 4141; https://doi.org/10.3390/ma12244141
Received: 8 November 2019 / Revised: 4 December 2019 / Accepted: 9 December 2019 / Published: 10 December 2019
This paper discusses a non-destructive measurement technique of residual stress through optical visualization. The least amount of deformation possible is applied to steel plates by heating the specimens +10 °C from room temperature for initial calibration, and the thermal expansion behavior is visualized with an electronic speckle pattern interferometer sensitive to two dimensional in-plane displacement. Displacement distribution with the thermal deformation and coefficient of thermal expansion are obtained through interferometric fringe analysis. The results suggest the change in the thermal deformation behavior is affected by the external stress initially applied to the steel specimen. Additionally, dissimilar joints of steel and cemented carbide plates are prepared by butt-brazing. The residual stress is estimated based on the stress dependence of thermal expansion coefficient. View Full-Text
Keywords: non-destructive testing; optical interferometry; residual stress; thermal expansion; dissimilar bonding non-destructive testing; optical interferometry; residual stress; thermal expansion; dissimilar bonding
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MDPI and ACS Style

Sasaki, T.; Yoshida, S.; Ogawa, T.; Shitaka, J.; McGibboney, C. Effect of Residual Stress on Thermal Deformation Behavior. Materials 2019, 12, 4141. https://doi.org/10.3390/ma12244141

AMA Style

Sasaki T, Yoshida S, Ogawa T, Shitaka J, McGibboney C. Effect of Residual Stress on Thermal Deformation Behavior. Materials. 2019; 12(24):4141. https://doi.org/10.3390/ma12244141

Chicago/Turabian Style

Sasaki, Tomohiro; Yoshida, Sanichiro; Ogawa, Tadashi; Shitaka, Jun; McGibboney, Conor. 2019. "Effect of Residual Stress on Thermal Deformation Behavior" Materials 12, no. 24: 4141. https://doi.org/10.3390/ma12244141

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