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Open AccessArticle

In-Situ Raman Characterization of Initial Corrosion Behavior of Copper in Neutral 3.5% (wt.) NaCl Solution

by Ming Liu 1,* and Jun Li 2,*
1
State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi’an Jiaotong University, Xi’an 710049, China
2
Corrosion and Protection Center, University of Science and Technology Beijing, Beijing 100083, China
*
Authors to whom correspondence should be addressed.
Materials 2019, 12(13), 2164; https://doi.org/10.3390/ma12132164
Received: 3 March 2019 / Revised: 30 June 2019 / Accepted: 2 July 2019 / Published: 5 July 2019
(This article belongs to the Section Corrosion)
In order to investigate the role of chloride ion in the corrosion film formation of copper and its evolution over time, the initial corrosion behavior of copper in neutral 3.5% (wt.) NaCl solution was characterized by in-situ Raman spectroscopy along with electrochemical tests. The results demonstrated that the cuprous chloride complexes, such as CuCl and CuCl 2 were produced through electrode processes, while the cuprite, Cu 2 O seemed to be formed via the chemical precipitation reaction instead of a direct electrochemical transformation from the metal matrix or CuCl and it occurred rather slowly. At the open circuit potential, the chlorides were generated first in the initial 2 h and then they transformed to the oxides with the CuCl 2 content in the interface increasing. The in-situ Raman characterization directly evidenced the previously reported mechanism of growth of oxide layers on copper surfaces in neutral Cl media and clearly showed the formation of a corrosion product film and its evolution over time. The electrochemical tests corresponded to the results of in-situ Raman characterization well. View Full-Text
Keywords: copper; Cl medium; initial corrosion behavior; in-situ Raman characterization copper; Cl medium; initial corrosion behavior; in-situ Raman characterization
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MDPI and ACS Style

Liu, M.; Li, J. In-Situ Raman Characterization of Initial Corrosion Behavior of Copper in Neutral 3.5% (wt.) NaCl Solution. Materials 2019, 12, 2164.

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