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Journal: Materials, 2019
Volume: 12
Number: 1593
1593
Article: Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic Temperature
Authors: by Xing Fu, Yunfei En, Bin Zhou, Si Chen, Yun Huang, Xiaoqi He, Hongtao Chen and Ruohe Yao
Link: https://www.mdpi.com/1996-1944/12/10/1593

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