Order Article Reprints
Journal: Energies, 2022
Volume: 15
Number: 4623
Article:
Simplified Recovery Process for Resistive Solder Bond (RSB) Hotspots Caused by Poor Soldering of Crystalline Silicon Photovoltaic Modules Using Resin
Authors:
by
Koo Lee, Sung Bae Cho, Junsin Yi and Hyo Sik Chang
Link:
https://www.mdpi.com/1996-1073/15/13/4623
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.