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Journal: Energies, 2022
Volume: 15
Number: 4623

Article: Simplified Recovery Process for Resistive Solder Bond (RSB) Hotspots Caused by Poor Soldering of Crystalline Silicon Photovoltaic Modules Using Resin
Authors: by Koo Lee, Sung Bae Cho, Junsin Yi and Hyo Sik Chang
Link: https://www.mdpi.com/1996-1073/15/13/4623

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