Jung, Y.;                     Min, K.;                     Bae, S.;                     Sim, M.;                     Kang, Y.;                     Lee, H.;                     Kim, D.    
        Pre-Texturing Thermal Treatment for Saw-Damage-Removal-Free Wet Texturing of Monocrystalline Silicon Wafers. Energies 2020, 13, 6610.
    https://doi.org/10.3390/en13246610
    AMA Style
    
                                Jung Y,                                 Min K,                                 Bae S,                                 Sim M,                                 Kang Y,                                 Lee H,                                 Kim D.        
                Pre-Texturing Thermal Treatment for Saw-Damage-Removal-Free Wet Texturing of Monocrystalline Silicon Wafers. Energies. 2020; 13(24):6610.
        https://doi.org/10.3390/en13246610
    
    Chicago/Turabian Style
    
                                Jung, Yujin,                                 Kwanhong Min,                                 Soohyun Bae,                                 Myeongseob Sim,                                 Yoonmook Kang,                                 Haeseok Lee,                                 and Donghwan Kim.        
                2020. "Pre-Texturing Thermal Treatment for Saw-Damage-Removal-Free Wet Texturing of Monocrystalline Silicon Wafers" Energies 13, no. 24: 6610.
        https://doi.org/10.3390/en13246610
    
    APA Style
    
                                Jung, Y.,                                 Min, K.,                                 Bae, S.,                                 Sim, M.,                                 Kang, Y.,                                 Lee, H.,                                 & Kim, D.        
        
        (2020). Pre-Texturing Thermal Treatment for Saw-Damage-Removal-Free Wet Texturing of Monocrystalline Silicon Wafers. Energies, 13(24), 6610.
        https://doi.org/10.3390/en13246610