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Knoblich M, Al Ktash M, Wackenhut F, Englert T, Stiedl J, Wittel H, Green S, Jacob T, Boldrini B, Ostertag E, et al. Rapid Detection of Cleanliness on Direct Bonded Copper Substrate by Using UV Hyperspectral Imaging. Sensors. 2024; 24(14):4680. https://doi.org/10.3390/s24144680

Knoblich, Mona, Mohammad Al Ktash, Frank Wackenhut, Tim Englert, Jan Stiedl, Hilmar Wittel, Simon Green, Timo Jacob, Barbara Boldrini, Edwin Ostertag, and et al. 2024. "Rapid Detection of Cleanliness on Direct Bonded Copper Substrate by Using UV Hyperspectral Imaging" Sensors 24, no. 14: 4680. https://doi.org/10.3390/s24144680

Knoblich, M., Al Ktash, M., Wackenhut, F., Englert, T., Stiedl, J., Wittel, H., Green, S., Jacob, T., Boldrini, B., Ostertag, E., Rebner, K., & Brecht, M. (2024). Rapid Detection of Cleanliness on Direct Bonded Copper Substrate by Using UV Hyperspectral Imaging. Sensors, 24(14), 4680. https://doi.org/10.3390/s24144680