Order Article Reprints
Journal: Sensors, 2022
Volume: 22
Number: 2114
Article:
Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter
Authors:
by
Zuohuan Chen, Daquan Yu and Yi Zhong
Link:
https://www.mdpi.com/1424-8220/22/6/2114
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.