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Journal: Sensors, 2022
Volume: 22
Number: 2114

Article: Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter
Authors: by Zuohuan Chen, Daquan Yu and Yi Zhong
Link: https://www.mdpi.com/1424-8220/22/6/2114

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