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Journal: Sensors, 2022
Volume: 22
Number: 6696

Article: Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration
Authors: by Weihua Yu, Abbas Vosoogh, Bowu Wang and Zhongxia Simon He
Link: https://www.mdpi.com/1424-8220/22/17/6696

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