Zhang, Y.; Li, B.; Li, H.; Shen, S.; Li, F.; Ni, W.; Cao, W.
Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor. Sensors 2021, 21, 2011.
https://doi.org/10.3390/s21062011
AMA Style
Zhang Y, Li B, Li H, Shen S, Li F, Ni W, Cao W.
Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor. Sensors. 2021; 21(6):2011.
https://doi.org/10.3390/s21062011
Chicago/Turabian Style
Zhang, Yunfan, Bowen Li, Hui Li, Shengnan Shen, Feng Li, Wentao Ni, and Wan Cao.
2021. "Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor" Sensors 21, no. 6: 2011.
https://doi.org/10.3390/s21062011
APA Style
Zhang, Y., Li, B., Li, H., Shen, S., Li, F., Ni, W., & Cao, W.
(2021). Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor. Sensors, 21(6), 2011.
https://doi.org/10.3390/s21062011