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Journal: SensorsVolume: 20Number: 1755
Article: A High-Resolution Open Source Platform for Building Envelope Thermal Performance Assessment Using a Wireless Sensor Network
  • Authors:
  • Romwald Lihakanga1,2,*,
  • Yuan Ding2 and
  • Gabriela M. Medero1
  • et al.
Link: https://www.mdpi.com/1424-8220/20/6/1755

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