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Journal: Sensors, 2020
Volume: 20
Number: 1755

Article: A High-Resolution Open Source Platform for Building Envelope Thermal Performance Assessment Using a Wireless Sensor Network
Authors: by Romwald Lihakanga, Yuan Ding, Gabriela M. Medero, Samuel Chapman and George Goussetis
Link: https://www.mdpi.com/1424-8220/20/6/1755

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