Lihakanga, R.; Ding, Y.; Medero, G.M.; Chapman, S.; Goussetis, G.
A High-Resolution Open Source Platform for Building Envelope Thermal Performance Assessment Using a Wireless Sensor Network. Sensors 2020, 20, 1755.
https://doi.org/10.3390/s20061755
AMA Style
Lihakanga R, Ding Y, Medero GM, Chapman S, Goussetis G.
A High-Resolution Open Source Platform for Building Envelope Thermal Performance Assessment Using a Wireless Sensor Network. Sensors. 2020; 20(6):1755.
https://doi.org/10.3390/s20061755
Chicago/Turabian Style
Lihakanga, Romwald, Yuan Ding, Gabriela M. Medero, Samuel Chapman, and George Goussetis.
2020. "A High-Resolution Open Source Platform for Building Envelope Thermal Performance Assessment Using a Wireless Sensor Network" Sensors 20, no. 6: 1755.
https://doi.org/10.3390/s20061755
APA Style
Lihakanga, R., Ding, Y., Medero, G. M., Chapman, S., & Goussetis, G.
(2020). A High-Resolution Open Source Platform for Building Envelope Thermal Performance Assessment Using a Wireless Sensor Network. Sensors, 20(6), 1755.
https://doi.org/10.3390/s20061755