A Simplified SSY Estimate Method to Determine EPFM Constraint Parameter for Sensor Design†
AbstractTo implement a sensor structure analysis and design (as well as other engineering applications), a two-parameter approach using elastic–plastic fracture mechanics (EPFM) could be applied to analyze a structure more accurately than a one-parameter approach, especially for structures with low crack constraint. The application of the J-A two-parameter approach on sensors and other structures depends on the obtainment of a constraint parameter A. To conveniently and effectively obtain the A parameter values, the authors have developed a T-stress-based estimate method under a small-scale yielding (SSY) condition. Under a uniaxial external loading condition, a simplified format of the T-stress-based estimate has been proposed by the authors to obtain the parameter A much more conveniently and effectively. Generally, sensors and other practical engineering structures endure biaxial external loading instead of the uniaxial one. In the current work, the simplified formation of the estimate method is extended to a biaxial loading condition. By comparing the estimated A parameter values with their numerical solutions from a finite element analysis (FEA) results, the extension of the simplified formation of T-stress-based estimate method to biaxial loading was discussed and validated. The comparison procedure was completed using a wide variety of materials and geometrical properties on three types of specimens: single edge cracked plate (SECP), center cracked plate (CCP), and double edge cracked plate (DECP). View Full-Text
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Ding, P.; Wang, X. A Simplified SSY Estimate Method to Determine EPFM Constraint Parameter for Sensor Design. Sensors 2019, 19, 717.
Ding P, Wang X. A Simplified SSY Estimate Method to Determine EPFM Constraint Parameter for Sensor Design. Sensors. 2019; 19(3):717.Chicago/Turabian Style
Ding, Ping; Wang, Xin. 2019. "A Simplified SSY Estimate Method to Determine EPFM Constraint Parameter for Sensor Design." Sensors 19, no. 3: 717.
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