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Journal: Sensors, 2015
Volume: 15
Number: 29648
Article:
Study and Test of a New Bundle-Structure Riser Stress Monitoring Sensor Based on FBG
Authors:
by
Jian Xu, Dexing Yang, Chuan Qin, Yajun Jiang, Leixiang Sheng, Xiangyun Jia, Yang Bai, Xiaohong Shen, Haiyan Wang, Xin Deng, Liangbin Xu and Shiquan Jiang
Link:
https://www.mdpi.com/1424-8220/15/11/29648
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