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Journal: Sensors, 2015
Volume: 15
Number: 29648

Article: Study and Test of a New Bundle-Structure Riser Stress Monitoring Sensor Based on FBG
Authors: by Jian Xu, Dexing Yang, Chuan Qin, Yajun Jiang, Leixiang Sheng, Xiangyun Jia, Yang Bai, Xiaohong Shen, Haiyan Wang, Xin Deng, Liangbin Xu and Shiquan Jiang
Link: https://www.mdpi.com/1424-8220/15/11/29648

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