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Open AccessArticle

A Low-Power Integrated Humidity CMOS Sensor by Printing-on-Chip Technology

Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 10617, Taiwan
Intel Lab, Hillsboro, OR 97124, USA
Department of Engineering Science and Ocean Engineering, National Taiwan University, Taipei 10617, Taiwan
Author to whom correspondence should be addressed.
Sensors 2014, 14(5), 9247-9255;
Received: 25 April 2014 / Revised: 19 May 2014 / Accepted: 20 May 2014 / Published: 23 May 2014
(This article belongs to the Special Issue Printed Sensors)
PDF [299 KB, uploaded 21 June 2014]


A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene)/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems. View Full-Text
Keywords: sensor integration; inkjet printing; gas sensor sensor integration; inkjet printing; gas sensor
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Lee, C.-H.; Chuang, W.-Y.; Cowan, M.A.; Wu, W.-J.; Lin, C.-T. A Low-Power Integrated Humidity CMOS Sensor by Printing-on-Chip Technology. Sensors 2014, 14, 9247-9255.

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