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Journal: Sensors, 2013
Volume: 13
Number: 16281

Article: Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer
Authors: by Lei Su, Tielin Shi, Zhensong Xu, Xiangning Lu and Guanglan Liao
Link: https://www.mdpi.com/1424-8220/13/12/16281

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