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Journal: Sensors, 2013
Volume: 13
Number: 16281
Article:
Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer
Authors:
by
Lei Su, Tielin Shi, Zhensong Xu, Xiangning Lu and Guanglan Liao
Link:
https://www.mdpi.com/1424-8220/13/12/16281
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