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Entropy 2019, 21(1), 16; https://doi.org/10.3390/e21010016

Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes

1
Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen 361005, China
2
Shenzhen Research Institute of Xiamen University, Shenzhen 518000, China
3
Tianjin Key Laboratory for Civil Aircraft Airworthiness and Maintenance Airworthiness and Maintenance, Civil Aviation University of China, Tianjin 300300, China
4
Hubei Key Laboratory of Mechanical Transmission and Manufacturing Engineering in Wuhan University of Science and Technology, Wuhan 430000, China
*
Author to whom correspondence should be addressed.
Received: 23 October 2018 / Revised: 2 December 2018 / Accepted: 21 December 2018 / Published: 25 December 2018
(This article belongs to the Special Issue Non-Equilibrium Thermodynamics of Micro Technologies)
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Abstract

This work numerically studies the thermal and hydraulic performance of double-layered microchannel heat sinks (DL-MCHS) for their application in the cooling of high heat flux microelectronic devices. The superiority of double-layered microchannel heat sinks was assessed by a comparison with a single-layered microchannel heat sink (SL-MCHS) with the same triangular microchannels. Five DL-MCHSs with different cross-sectional shapes—triangular, rectangular, trapezoidal, circular and reentrant Ω-shaped—were explored and compared. The results showed that DL-MCHS decreased wall temperatures and thermal resistance considerably, induced much more uniform wall temperature distribution, and reduced the pressure drop and pumping power in comparison with SL-MCHS. The DL-MCHS with trapezoidal microchannels performed the worst with regard to thermal resistance, pressure drop, and pumping power. The DL-MCHS with rectangular microchannels produced the best overall thermal performance and seemed to be the optimum when thermal performance was the prime concern. Nevertheless, the DL-MCHS with reentrant Ω-shaped microchannels should be selected when pumping power consumption was the most important consideration. View Full-Text
Keywords: double-layered microchannel heat sinks; microchannel shape; numerical simulation; thermal resistance double-layered microchannel heat sinks; microchannel shape; numerical simulation; thermal resistance
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Deng, D.; Pi, G.; Zhang, W.; Wang, P.; Fu, T. Numerical Study of Double-Layered Microchannel Heat Sinks with Different Cross-Sectional Shapes. Entropy 2019, 21, 16.

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