Search Results (7)

In response to the issue of the insufficient adhesion strength of polypropylene materials, a plasma–ultrasonic treatment is proposed. Plasma treatment is first conducted to activate the polypropylene adherends, and then ultrasonic vibration is applied to the adhesive to facilitate the interface contact, enhancing the bonding performance of polypropylene. The shear strength of the test specimens was assessed using single-lap shear tests. The bonding samples were characterized by scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS), contact angle, and infrared analysis to explore the bonding mechanism of plasma–ultrasonic treatment. The results show that compared to untreated polypropylene specimens, the plasma treatment process increased the shear strength of the polypropylene specimens by 370.3%, and the addition of ultrasonic-assisted technology further increased the shear strength of the polypropylene specimens by 10.6%. The coefficient of variation decreased from 0.53 in the untreated sample to 0.32 for the plasma–ultrasonic treatment, enhancing the stability of adhesion. Plasma treatment introduces active groups, such as hydroxyl groups, onto the surface of polypropylene and increases the surface roughness of polypropylene. Ultrasonic treatment promotes the penetration of adhesive microstructures on the surface of polypropylene, enhancing the anchoring effect of the adhesive, thereby improving bonding performance. Furthermore, through molecular dynamics analysis, compared to the untreated polypropylene bonding system, the bonding energy of the bonding system under the plasma–ultrasonic treatment was increased by 57%, effectively enhancing the shear strength of polypropylene bonding. Plasma–ultrasonic treatment can effectively improve the bonding strength of polypropylene, providing a new idea for the study of polymer bonding. Full article

Achieving high-strength welding joint of aluminum to steel is a highly pressing and challenging task in the manufacturing industries, and friction stir lap welding (FSLW) has advantages for joining these two metals. To further heighten the strength of dissimilar aluminum and steel metals (Al/steel) FSLW joint, the ultrasonic-assisted FSLW (UAFSLW) process was used, and the upper 2024-T4 aluminum alloy and the lower 304 stainless steel were chosen as research object. The results show that the addition of ultrasound eliminates the micro pores, changes the aluminum-rich intermetallic compounds (IMCs) into the iron-rich IMCs and enhances the micro and macro mechanical interlocking structures along the Al/steel lap interface. Under the rational IMCs layer thickness lower than 1.5 μm, the UAFSLW joint has the failure load higher than the traditional FSLW joint. The maximum failure load of UAFSLW joint reaches 7.06 kN, and the loading capacity of this joint is higher than that of reported Al/steel traditional FSLW joint. The UAFSLW process is an effective way to fabricate the high-strength Al/steel lap joint. Full article

Polymers are increasingly being used in higher demanding applications due to their ability to tailor the properties of structures while allowing for a weight and cost reduction. Solvents play an important role in the manufacture of polymeric structures since they allow for a reduction in the polymer’s viscosity or assist with the dispersion of fillers into the polymer matrix. However, the incorrect removal of the solvent affects both the physical and chemical properties of polymeric materials. The presence of residual solvent can also negatively affect the curing kinetics and the final quality of polymers. Destructive testing is mainly performed to characterize the properties of these materials. However, this type of testing involves using lab-type equipment that cannot be taken in-field to perform in situ testing and requires a specific sample preparation. Here, a method is presented to non-destructively evaluate the curing process and final viscoelastic properties of polymeric materials using ultrasonics. In this study, changes in longitudinal sound speed were detected during the curing of an aerospace epoxy adhesive as a result of variations in polymer chemistry. To simulate the presence of residual solvent, samples containing different weight percentages of isopropyl alcohol were manufactured and tested using ultrasonics. Thermogravimetric analysis was used to show changes in the decomposition of the adhesive due to the presence of IPA within the polymer structure. Adding 2, 4, and 6 wt.% of IPA decreased the adhesive’s lap shear strength by 40, 58, and 71%, respectively. Ultrasonics were used to show how the solvent influenced the curing process and the final sound speed of the adhesive. Young’s modulus and Poisson’s ratio were determined using both the longitudinal and shear sound speeds of the adhesive. Using ultrasonics has the potential to non-invasively characterize the quality of polymers in both an in-field and manufacturing settings, ensuring their reliability during use in demanding applications. Full article

A dissimilar AA7075/Q235 butt-lap joint was fabricated via ultrasonic-assisted friction stir welding (UaFSW), and the characteristics of the UaFSW joint were investigated systematically. The acoustoplastic effect of the ultrasonic vibration led to the softening of the materials and enhanced the material flow during welding, decreasing the volume of welding defects in the nugget zone of the UaFSW joint. With the help of ultrasonic vibration, a smooth and thin intermetallic compounds (IMCs) layer could generate along the Al/steel interface at the top of nugget zone, which possibly consisted of Al₅Fe₂ and Al₁₃Fe₄ phases. However, the positive effects of the ultrasonic vibration were weakened at low temperatures; consequently, the IMCs layer became discontinuous at the bottom of the nugget zone and the welding defects also formed. The ultrasonic vibration accelerated the dynamic recrystallization and refined the microstructures in the nugget zone due to the increased strain rate and stored energy. As a result, the UaFSW joint exhibited a better mechanical performance in comparison to the FSW joint, and the increment in the peak tensile load/elongation was more than twice. In addition, the UaFSW joint failed in the nugget zone along with the Al/steel interface, and the fracture mode was a mixture of ductile and brittle. Full article

Silicon carbide (SiC) devices have become one of the key research directions in the field of power electronics. However, due to the limitation of the SiC wafer growth process and processing capacity, SiC devices, such as SiC MOSFET (Metal-oxide-semiconductor Field-effect Transistor), are facing the problems of high cost and unsatisfied performance. To improve the precise machinability of single-crystal SiC wafer, this paper proposed a new hybrid process. Firstly, we developed an ultrasonic vibration-assisted device, by which ultrasonic-assisted lapping and ultrasonic-assisted CMP (chemical mechanical polishing) for SiC wafer were fulfilled. Secondly, a novel three-step ultrasonic-assisted precise machining route was proposed. In the first step, ultrasonic lapping using a cast iron disc was conducted, which quickly removed large surface damages with a high MRR (material removal rate) of 10.93 μm/min. In the second step, ultrasonic lapping using a copper disc was conducted, which reduced the residual surface defects with a high MRR of 6.11 μm/min. In the third step, ultrasonic CMP using a polyurethane pad was conducted, which achieved a smooth and less damaged surface with an MRR of 1.44 μm/h. These results suggest that the ultrasonic-assisted hybrid process can improve the precise machinability of SiC, which will hopefully achieve high-efficiency and ultra-precision machining. Full article

In this work, friction stir lap welding (FSLW) and ultrasonic-assisted friction stir lap welding (UAFSLW) was applied to 6-mm-thick 7075-T6 alloy sheets using three welding tools with the same process parameters. The joint formation, microstructural characteristics, and mechanical properties of the resulting lap joints were then investigated. The results showed that ultrasonic vibration significantly promoted the flow of metal at the interface, enlarged the size of the stirred zone (SZ), and reduced the angle between the hook defect and the interface. During lap shear testing, the FSLW and UAFSLW joints fractured in a similar manner. The fracture modes included tensile fracture, shear fracture, and a mixture of both. Cold lap and hook defects may have served as crack-initiation zones within the joint. Under configuration A (i.e., upper sheet on the retreating side (RS)), all joints failed in the shear-fracture mode. The effective lap width (ELW) of the joint welded using tool T2 was the greatest. This resulted in a higher shear fracture strength. The maximum shear fracture strength of the UAFSLW joint was 663.1 N/mm. Under configuration B (i.e., upper sheet on the advancing side (AS)), the shear fracture strength was greatly affected by the fracture mode. The highest shear fracture strength of the UAFSLW joint, 543.7 N/mm, was welded by tool T3. Thus, under otherwise identical conditions, UAFSLW joints can withstand a greater fracture shear strength than FSLW joints, as ultrasonic vibration helps to mix the material at the interface, thus, enlarging the SZ and diminishing the cold lap defects. Full article

A new method of ultrasonic chemical mechanical polishing (CMP) combined with ultrasonic lapping is introduced to improve the machining performance of carbide silicon (SiC). To fulfill the method, an ultrasonic assisted machining apparatus is designed and manufactured. Comparative experiments with and without ultrasonic assisted vibration are conducted. According to the experimental results, the material removal rate (MRR) and surface generation are investigated. The results show that both ultrasonic lapping and ultrasonic CMP can decrease the two-body abrasion and reduce the peak-to-valley (PV) value of surface roughness, the effect of ultrasonic in lapping can contribute to the higher MRR and better surface quality for the following CMP. The ultrasonic assisted vibration in CMP can promote the chemical reaction, increase the MRR and improve the surface quality. The combined ultrasonic CMP with ultrasonic lapping achieved the highest MRR of 1.057 μm/h and lowest PV value of 0.474 μm. Therefore this sequent ultrasonic assisted processing method can be used to improve the material removal rate and surface roughness for the single crystal SiC wafer. Full article