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Keywords = thermodiodes

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15 pages, 3582 KiB  
Article
An Innovative Trombe Wall for Winter Use: The Thermo-Diode Trombe Wall
by Jerzy Szyszka, Piero Bevilacqua and Roberto Bruno
Energies 2020, 13(9), 2188; https://doi.org/10.3390/en13092188 - 1 May 2020
Cited by 44 | Viewed by 8759
Abstract
The use of passive solutions for building envelopes represents an important step toward the achievement of more efficient and zero-energy building targets. Trombe walls are an interesting and viable option for the reduction of building energy requirements for heating, especially in cold climates. [...] Read more.
The use of passive solutions for building envelopes represents an important step toward the achievement of more efficient and zero-energy building targets. Trombe walls are an interesting and viable option for the reduction of building energy requirements for heating, especially in cold climates. This study presents the experimental analysis of an innovative Trombe wall configuration, named a thermo-diode Trombe wall, which was specifically designed to improve the energy efficiency by providing a proper level of insulation for the building envelope. Such a design is essential in cold climates to limit the thermal losses whilst increasing solar heat gains to the heated spaces. An experimental campaign was conducted from December to March that involved monitoring the external climatic conditions and the main thermal parameters to assess the thermal performance of the proposed solution. The results demonstrated that in the presence of solar radiation, the thermo-diode Trombe wall was able to generate significant natural convection inside the air cavity, with temperatures higher than 35 °C in the upper section, by providing consistent heat gains for the indoor environment, even on cold days and for hours after the end of the daylight. The efficiency, relative to the incident solar radiation, reached 15.3% during a well-insolated winter day. Full article
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16 pages, 5378 KiB  
Article
An SOI CMOS-Based Multi-Sensor MEMS Chip for Fluidic Applications
by Mohtashim Mansoor, Ibraheem Haneef, Suhail Akhtar, Muhammad Aftab Rafiq, Andrea De Luca, Syed Zeeshan Ali and Florin Udrea
Sensors 2016, 16(11), 1608; https://doi.org/10.3390/s16111608 - 4 Nov 2016
Cited by 27 | Viewed by 10053
Abstract
An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), [...] Read more.
An SOI CMOS multi-sensor MEMS chip, which can simultaneously measure temperature, pressure and flow rate, has been reported. The multi-sensor chip has been designed keeping in view the requirements of researchers interested in experimental fluid dynamics. The chip contains ten thermodiodes (temperature sensors), a piezoresistive-type pressure sensor and nine hot film-based flow rate sensors fabricated within the oxide layer of the SOI wafers. The silicon dioxide layers with embedded sensors are relieved from the substrate as membranes with the help of a single DRIE step after chip fabrication from a commercial CMOS foundry. Very dense sensor packing per unit area of the chip has been enabled by using technologies/processes like SOI, CMOS and DRIE. Independent apparatuses were used for the characterization of each sensor. With a drive current of 10 µA–0.1 µA, the thermodiodes exhibited sensitivities of 1.41 mV/°C–1.79 mV/°C in the range 20–300 °C. The sensitivity of the pressure sensor was 0.0686 mV/(Vexcit kPa) with a non-linearity of 0.25% between 0 and 69 kPa above ambient pressure. Packaged in a micro-channel, the flow rate sensor has a linearized sensitivity of 17.3 mV/(L/min)−0.1 in the tested range of 0–4.7 L/min. The multi-sensor chip can be used for simultaneous measurement of fluid pressure, temperature and flow rate in fluidic experiments and aerospace/automotive/biomedical/process industries. Full article
(This article belongs to the Special Issue Microfluidic Sensors and Control Devices)
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