Search Results (7)

The cutting of thick glass is extensively employed in aerospace, optical, and other fields. Although ultrafast laser Bessel beams are heavily used for glass cutting, the cutting thickness and cutting quality need to be further improved. In this research, the high-quality cutting of thick glass was realized for the first time using ultrafast laser perforation assisted by CO₂ laser separation. Initially, an infrared picosecond laser Bessel beam was employed to ablate the soda-lime glass and generate a perforated structure. Subsequently, a CO₂ laser was employed to induce crack propagation along the path of the perforated structure, resulting in the separation of the glass. This study investigates the influence of hole spacing, pulse energy, and the defocusing distance of the picosecond laser Bessel beam on the average surface roughness of the glass sample cutting surface. The optimal combination of cutting parameters for 6 mm thick glass results in a minimum surface roughness of 343 nm in the cross-section. Full article

Soda–lime glass has a wide range of applications in the fields of smart electronics, optical components, and precision originals. In order to investigate the effect of processing parameters on picosecond Bessel laser cutting of soda–lime glass and to achieve high-quality soda–lime glass cutting, a series of cutting experiments were conducted in this study. In this study, it was found that the machining point spacing, the incident laser energy, and the number of burst modes had a significant effect on the machining of the samples. The atomic force microscope (AFM) showed a better quality of roughness of the machined cross-section when the spacing of the machining points was 1 μm, a locally optimal solution was obtained when the number of burst modes was 2, and a locally optimal solution was also obtained when the incident laser power was 11.5 W. In this study, better machining quality was achieved for soda–lime glass of 1 mm thickness, with an average roughness of 158 nm and a local optimum of 141 nm. Full article

Dicing is a critical step in the manufacturing process for the application of sapphire. In this work, the dependence of sapphire dicing on crystal orientation using picosecond Bessel laser beam drilling combined with mechanical cleavage was studied. By using the above method, linear cleaving with on debris and zero tapers was realized for the A1, A2, C1, C2, and M1 orientations, except for the M2 orientation. The experimental results indicated that characteristics of Bessel beam-drilled microholes, fracture loads, and fracture sections of sapphire sheets were strongly dependent on crystal orientation. No cracks were generated around the micro holes when laser scanned along the A2 and M2 orientations, and the corresponding average fracture loads were large, 12.18 N and 13.57 N, respectively. While along the A1, C1, C2, and M1 orientations, laser-induced cracks extended along the laser scanning direction, resulting in a significant reduction in fracture load. Furthermore, the fracture surfaces were relatively uniform for A1, C1, and C2 orientations but uneven for A2 and M1 orientations, with a surface roughness of about 1120 nm. In addition, curvilinear dicing without debris or taper was achieved to demonstrate the feasibility of Bessel beams. Full article

A zeroth-order, non-diffracting Bessel beam, generated by picosecond laser pulses (1064 nm, 10 Hz, 30 ps) through an axicon, was utilized to perform pulse energy-dependent (12 mJ, 16 mJ, 20 mJ, 24 mJ) laser ablation of silver (Ag) substrates in air. The fabrication resulted in finger-like Ag nanostructures (NSs) in the sub-200 nm domain and obtained structures were characterized using the FESEM and AFM techniques. Subsequently, we employed those Ag NSs in surface-enhanced Raman spectroscopy (SERS) studies achieving promising sensing results towards trace-level detection of six different hazardous materials (explosive molecules of picric acid (PA) and ammonium nitrate (AN), a pesticide thiram (TH) and the dye molecules of Methylene Blue (MB), Malachite Green (MG), and Nile Blue (NB)) along with a biomolecule (hen egg white lysozyme (HEWL)). The remarkably superior plasmonic behaviour exhibited by the AgNS corresponding to 16 mJ pulse ablation energy was further explored. To accomplish a real-time application-oriented understanding, time-dependent studies were performed utilizing the AgNS prepared with 16 mJ and TH molecule by collecting the SERS data periodically for up to 120 days. The coated AgNSs were prepared with optimized gold (Au) deposition, accomplishing a much lower trace detection in the case of thiram (~50 pM compared to ~50 nM achieved prior to the coating) as well as superior EF up to ~10⁸ (~10⁶ before Au coating). Additionally, these substrates have demonstrated superior stability compared to those obtained before Au coating. Full article

Ultrashort Bessel beams have been used in this work to study the response of a 430-μm-thick monocrystalline sapphire sample to laser–matter interaction when injecting the beam orthogonally through the whole sample thickness. We show that with a 12° Bessel beam cone angle, we are able to internally modify the material and generate tailorable elongated microstructures while preventing the formation of surface cracks, even in the picosecond regime, contrary to what was previously reported in the literature. On the other hand, by means of Bessel beam machining combined with a trepanning technique where very high energy pulses are needed, we were able to generate 100 μm diameter through-holes, eventually with negligible cracks and very low taper angles thanks to an optimization achieved by using a 60-μm-thick layer of Kapton Polyimide removable tape. Full article

Micro-drilling transparent dielectric materials by using non-diffracting beams impinging orthogonally to the sample can be performed without scanning the beam position along the sample thickness. In this work, the laser micromachining process, based on the combination of picosecond pulsed Bessel beams with the trepanning technique, is applied to different transparent materials. We show the possibility to create through-apertures with diameter on the order of tens of micrometers, on dielectric samples with different thermal and mechanical characteristics as well as different thicknesses ranging from two hundred to five hundred micrometers. Advantages and drawbacks of the application of this technique to different materials such as glass, polymer, or diamond are highlighted by analyzing the features, the morphology, and the aspect-ratio of the through-holes generated. Alternative Bessel beam drilling configurations, and the possibility of optimization of the quality of the aperture at the output sample/air interface is also discussed in the case of glass. Full article

Ultrafast non-diffractive Bessel laser beams provide strong light confinement and show robust advantages for fabricating high-aspect-ratio nanoscale structures inside transparent materials. They take the form of nanoscale voids with typical diameters well below the wavelength and aspect ratio of more than 1000. Delivering 3D morphologies of such nanoscale voids is an important issue to evaluate the result for fabrication. However, the characterization of such laser-induced structures is a difficult task. Here, an accurate and time-saving tomography-like methodology is proposed and adopted for reconstructing the morphology of high-aspect-ratio nano-holes. The technique allows an accurate assertion of laser parameters and position on nano-structured features. The reconstructed configuration reveals that nanoholes morphologies have a close relationship with energy distribution in the focal region. It suggests that the configuration of micro-explosion can be controlled by laser energy deposition in the process of laser-matter interaction down to the nanoscale. Full article