Search Results (3)

The electrical contact and tribological performance of contacts are critical for the reliable transmission of electric power and signals. In this study, a nickel layer was applied as an underlayer at the interface, and the effects of its thickness and plating process on the electrical and tribological properties were systematically investigated. Results showed that the coefficient of friction (COF) was reduced due to the nickel layer. The wear loss significantly decreased as the nickel layer thickness increased from 0.5 μm to 2 μm. This is primarily due to the nickel layer reducing adhesive wear. Additionally, the electrical contact resistance (ECR) increased as the top coating was worn out, owing to a reduction in the effective conductive area. Furthermore, ECR, COF, and wear rate were further reduced when the nickel layer was deposited using electroless plating compared with electroplating. In conclusion, the wear resistance of electrical contacts can be improved by a thicker nickel layer or electroless plating. This study provides a theoretical basis for understanding the role of the nickel layer in improving sliding electrical contact and wear behaviors. Full article

The semiconductor industry uses a physical vapor-deposition process, with a nickel-tantalum (NiTa) alloy-sputtering target, to apply an amorphous NiTa thin film layer between the magnetic soft underlayer and substrate of a heat-assisted magnetic-recording hard disk drive. Currently, the alloy-sputtering target is produced through a hot-pressing (HP) process followed by a hot isostatic pressing (HIP). In this study, we demonstrate a better process for producing the sputtering targets, using laser powder-bed fusion (L-PBF) followed by vacuum heat treatment (VHT), to produce alloy targets with superior microstructural characteristics that will produce better-quality thin films. We compare as-fabricated (just L-PBF) specimens with specimens produced by L-PBF and then annealed at different conditions. Where the as-fabricated specimens are characterized by columnar dendrites, annealing at 1275 °C for 4 h produces a uniform equiaxed grain microstructure and a uniformly dispersed fcc Ta precipitate. In addition, the average microhardness value is reduced from 725 ± 40 to 594 ± 26 HV0.2 and the maximum compressive residual stress is reduced from 180 ± 50 MPa to 20 ± 10 MPa as the result of dislocation elimination during the recovery and recrystallization process. Finally, due to microstructure recrystallization, the VHT-treated L-PBF NiTa specimens exhibit a smaller grain size (2.1 ± 0.2 µm) than the traditional HIP-treated HP specimens (6.0 ± 0.6 µm). Full article

Since the use of the most stable Pb-based materials in the electronic industry has been banned due to human health concerns, numerous research studies have focused on Pb-free materials such as pure tin and its alloys for electronic applications. Pure tin, however, suffers from tin whiskers’ formation, which tends to endanger the efficiency of electronic circuits, and even worse, may cause short circuits to the electronic components. This research aims to investigate the effects of stress on tin whiskers’ formation and growth and the mitigation method for the immersion of the tin surface’s finish deposited on a copper substrate. The coated surface was subjected to external stress by micro-hardness indenters with a 2N load in order to simulate external stress applied to the coating layer, prior to storage in the humidity chamber with environmental conditions of 30 °C/60% RH up to 52 weeks. A nickel underlayer was deposited between the tin surface finish and copper substrate to mitigate the formation and growth of tin whiskers. FESEM was used to observe the whiskers and EDX was used for measuring the chemical composition of the surface finish, tin whiskers, and oxides formed after a certain period of storage. An image analyzer was used to measure the whiskers’ length using the JEDEC Standard (JESD22-A121A). The results showed that the tin whiskers increased directly proportional to the storage time, and they formed and grew longer on the thicker tin coating (2.3 μm) than the thin coating (1.5 μm). This is due to greater internal stress being generated by the thicker intermetallic compounds identified as the Cu₅Sn₆ phase, formed on a thicker tin coating. In addition, the formation and growth of CuO flowers on the 1.5 μm-thick tin coating suppressed the growth of tin whiskers. However, the addition of external stress by an indentation on the tin coating surface showed that the tin whiskers’ growth discontinued after week 4 in the indented area. Instead, the whiskers that formed were greater and longer at a distance farther from the indented area due to Sn atom migration from a high stress concentration to a lower stress concentration. Nonetheless, the length of the whisker for the indented surface was shorter than the non-indented surface because the whiskers’ growth was suppressed by the formation of CuO flowers. On the other hand, a nickel underlayer successfully mitigated the formation of tin whiskers upon the immersion of a tin surface finish. Full article