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Keywords = laser dot projection

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24 pages, 10155 KiB  
Article
Co-Package Technology Platform for Low-Power and Low-Cost Data Centers
by Konstantinos Papatryfonos, David R. Selviah, Avi Maman, Kobi Hasharoni, Antoine Brimont, Andrea Zanzi, Jochen Kraft, Victor Sidorov, Marc Seifried, Yannick Baumgartner, Folkert Horst, Bert Jan Offrein, Katarzyna Lawniczuk, Ronald G. Broeke, Nikos Terzenidis, George Mourgias-Alexandris, Mingchu Tang, Alwyn J. Seeds, Huiyun Liu, Pablo Sanchis, Miltiadis Moralis-Pegios, Thanasis Manolis, Nikos Pleros, Konstantinos Vyrsokinos, Bogdan Sirbu, Yann Eichhammer, Hermann Oppermann and Tolga Tekinadd Show full author list remove Hide full author list
Appl. Sci. 2021, 11(13), 6098; https://doi.org/10.3390/app11136098 - 30 Jun 2021
Cited by 15 | Viewed by 8234
Abstract
We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes [...] Read more.
We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light modulation were developed to assist in achieving an efficient performance of the module. Integration of DFB laser sources within each cell in the matrix was demonstrated as well using wafer bonding between the InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization and gain stack designs were developed. Packaging of these 2D photonic arrays in a chiplet configuration was demonstrated using a vertical integration approach in which the optical interconnect matrix was flip-chip assembled on top of a CMOS mimic chip with 2D vertical fiber coupling. The optical chiplet was further assembled on a substrate to facilitate integration with the multi-chip module of the co-packaged system with a switch surrounded by several such optical chiplets. We summarize the features of the L3MATRIX co-package technology platform and its holistic toolbox of technologies to address the next generation of computing challenges. Full article
(This article belongs to the Special Issue Frontiers in Optical Interconnects)
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18 pages, 7404 KiB  
Article
A High Reliability 3D Scanning Measurement of the Complex Shape Rail Surface of the Electromagnetic Launcher
by Zhaoxin Wang and Baoming Li
Sensors 2020, 20(5), 1485; https://doi.org/10.3390/s20051485 - 8 Mar 2020
Cited by 10 | Viewed by 3445
Abstract
After an electromagnetic railgun launch, a series of damage phenomena may cause the inner bore surface to become complex, such as gouging and deposition. Furthermore, the rail surface will be uneven and blackened by oxidation. To understand these forms of rail degradation, many [...] Read more.
After an electromagnetic railgun launch, a series of damage phenomena may cause the inner bore surface to become complex, such as gouging and deposition. Furthermore, the rail surface will be uneven and blackened by oxidation. To understand these forms of rail degradation, many previous studies have mentioned several surface scanning methods, but none of these can be used in the complex inner bore. Therefore, we present a 3D scanning system based on binocular stereovision technology combined with the active illumination, which can be used to obtain the rail surface topography under a complex inner bore environment. The laser dot projection is applied as the active illumination. In contrast with other active illumination, laser dot projection has high reconstruction reliability. By combining laser dot projection with binocular stereovision, the object can be completely reconstructed. In addition, an image acquisition method which can improve image signal-to-noise ratio is proposed. The proof-of-principle experiment of the system is done under dim light conditions. Through the experiment, the 3D depth map of the rail surface is obtained and the gouge crater is scanned out. Meanwhile, system evaluation and measurement uncertainty analysis have also been carried out. Full article
(This article belongs to the Section Optical Sensors)
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