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Keywords = HGCP

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14 pages, 3386 KB  
Article
Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites
by Omar Dagdag, Lahoucine El Gana, Rajesh Haldhar, Avni Berisha, Seong-Cheol Kim, Elyor Berdimurodov, Othman Hamed, Shehdeh Jodeh, Ekemini Daniel Akpan and Eno Effiong Ebenso
Crystals 2023, 13(3), 478; https://doi.org/10.3390/cryst13030478 - 10 Mar 2023
Cited by 16 | Viewed by 4005
Abstract
Cyclotriphosphazenes, a variety of inorganic rings together with a curing ingredient, 4,4′-methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical characteristics of epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, and thermosets were produced, and their curing behaviors were investigated. Using [...] Read more.
Cyclotriphosphazenes, a variety of inorganic rings together with a curing ingredient, 4,4′-methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical characteristics of epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, and thermosets were produced, and their curing behaviors were investigated. Using a molecular dynamics (MD) approach, the impact of cyclotriphosphazene on the characteristics of DGEBA composites is thoroughly explored in this paper. Results indicated that the glass transition temperatures (Tg) of DGEBA containing HGCP had slightly decreased compared to DGEBA. With the addition of HGCP to DGEBA, epoxy resin (DGEBA@HGCP@MDA) has a high thermal conductivity of 0.215284 W/m·K, with an increase of 116.04% more than pure DGEBA (0.185524 W/m·K). Moreover, the DGEBA@HGCP@MDA composite has high mechanical strength with a specific Young’s modulus of 5.4902 GPa. In order to forecast and analyze certain performances directly associated with the microstructure characteristics of the various cross-linked resin systems and their composite materials, an MD simulation approach will be quite valuable. Full article
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9 pages, 2968 KB  
Article
Rheological and Electrical Study of a Composite Material Based on an Epoxy Polymer Containing Cyclotriphosphazene
by O. Dagdag, M. El Gouri, A. El Mansouri, A. Outzourhit, A. El Harfi, O. Cherkaoui, A. El Bachiri, O. Hamed, S. Jodeh, G. Hanbali and B. Khalaf
Polymers 2020, 12(4), 921; https://doi.org/10.3390/polym12040921 - 16 Apr 2020
Cited by 23 | Viewed by 4170
Abstract
In this work, we have studied, formulated, prepared, and characterized the rheological and electrical behavior of a composite material based on an epoxy resin Diglycidyl Ether of Bisphenol A (DGEBA) reinforced with hexaglycidyl cyclotriphosphazene (HGCP). The epoxy system was cured with 4,4’-methylene dianiline [...] Read more.
In this work, we have studied, formulated, prepared, and characterized the rheological and electrical behavior of a composite material based on an epoxy resin Diglycidyl Ether of Bisphenol A (DGEBA) reinforced with hexaglycidyl cyclotriphosphazene (HGCP). The epoxy system was cured with 4,4’-methylene dianiline (MDA). DGEBA-HGCP-MDA epoxy composite materials with reinforced HGCP which varied from 5% to 10% by weight were prepared by mixing in the molten state. The morphology was evaluated by SEM. The rheological behavior was studied using small deformation rheology. The electrical characterization was carried out with a frequency variation range from 1 Hz to 100 KHz at room temperature. These measurements revealed that the rheological and electrical behaviors strongly depend on the quantity of HGCP in the DGEBA matrix. The linear viscoelastic properties study reveals that the modulus of elasticity G’ is dependent on the amount of HGCP present in the epoxy resin DGEBA. The capacitance-frequency measurements suggest a distribution of localized states in the band gap of the blends. Full article
(This article belongs to the Special Issue Epoxy Resins and Composites)
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